russian english
Phones: +7 (48251) 5-50-35
+7 (916) 614-60-13
MICROELECTRONIC PACKAGE MANUFACTURER
 
 

New products

Ceramic Leadless Chip Carriers KUYAL.432264.096.100

Number of Pins: 2

Description:

Surface Mount Type (SMD) ceramic package; The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Die bonding – adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Quartz crystal resonators; Monolithic filters

Termo proof End Seal Feedthroughs – IKPM-16

Unit designation Corps: IKPM-16

Description:

Metal-to-Ceramic sealed DC Feedthroughs.
The body feedthroughs can be attached to housing materials by soldered, welded

Typical Applications:

Battery and Capasitor end-seals

Package type – 8-lead Glass-to-Metal Flatpack Package KUYAL 431433.019 KUYAL 754529.021

Unit designation Corps: KUYAL 431433.019 KUYAL 754529.021

Number of Pins: 8

Description:

Flat package (FP). A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery;
The Bottom and the Walls of package are made from metal;
Surface mount package;
The terminal count - 8 insulated;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low Power Itegrated Circuits for industrial and military applications

Glass-To-Metal Package 4144.16-A

Unit designation Corps: 4144.16-A

Number of Pins: 16 insulated

Description:

4144.16-A packages have four tabs with holes for mounting to a heatsink;
The pin count – 16 insulated;
The basic method of the hermetic sealing - Resistance welding.

Typical Applications:

Monochip Power Circuits of: Amplifiers, Voltage Regulators, Rectifiers, Opto-electronics Devices
 
 
Copyright © JSC «MARS» factory»,
2001 - 2017ãîä