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New products

Number of Pins: 2

Termo proof End Seal Feedthroughs IKPM-16

Unit designation Corps: IKPM-16

Description:

Metal-to-Ceramic sealed DC Feedthroughs.
The body feedthroughs can be attached to housing materials by soldered, welded

Typical Applications:

Battery and Capasitor end-seals

Package type 8-lead Glass-to-Metal Flatpack Package KUYAL 431433.019 KUYAL 754529.021

Unit designation Corps: KUYAL 431433.019 KUYAL 754529.021

Number of Pins: 8

Description:

Flat package (FP). A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery;
The Bottom and the Walls of package are made from metal;
Surface mount package;
The terminal count - 8 insulated;
Die bonding eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low Power Itegrated Circuits for industrial and military applications

Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2102.14-10

Unit designation Corps: 2102.14-10

Number of Pins: 14 insulated

Description:

The Side Braze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic base; The quantity of pins - 14 ; Pin pitch - 2,5mm; Through-hole package (Plug-Ins); The bottom and the walls of these packages constructed of high temperature coffered ceramic; Die bonding eutectic or adhesive; The basic method of hermetic sealing - parallel seam welding; The DIP is widely used due to its reliability, high performance, and ease of use. They can be mounted on a PC board with socket, manual or automated equipment

Typical Applications:

Increased Reliability Integrated Circuits

Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2103.16-22

Unit designation Corps: 2103.16-22

Number of Pins: 16 insulated

Description:

The Side Braze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic base; The quantity of pins - 16 ; Pin pitch - 2,5mm; Through-hole package (Plug-Ins); The bottom and the walls of these packages constructed of high temperature coffered ceramic; Die bonding eutectic or adhesive; The basic method of hermetic sealing - parallel seam welding; The DIP is widely used due to its reliability, high performance, and ease of use. They can be mounted on a PC board with socket, manual or automated equipment.

Typical Applications:

Increased Reliability Integrated Circuits

Hermetic SMD Package -93-2 (SMD-0.5)

Unit designation Corps: -93-2 (SMD-0,5)

Number of Pins: 3

Description:

Surface Mount Type (SMD) transistor package is a rectangular package with contact pads on bottom of the package; The hermetic SMD package consists of three terminal pads, a ceramic housing (HTCC), a seal ring, and a lid; One Large & Two SmallerTerminal Pads (from Molybdenum-Copper) used to minimize the package thermal resistance; A semiconductor die is soldered to a large terminal pad; SMD packages have smaller size, lighter weight and low inductance in comparison to TO-type packages;The basic method of hermetic sealing - parallel seam welding; The SMDs find most of their use in higher power applications. This SMD package is usedin military and space applications where product reliability is imperative

Typical Applications:

MOSFET device; cathode terminal for a rectifier
 
 
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