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Hermetic Packages for Quartz Crystals, Ceramic Resonators, Monolithic Filters

Ceramic Leadless Chip Carriers KUYAL.432264.090, KUYAL.432264.085, KUYAL.432264.100

Description:

Surface Mount Type (SMD) ceramic package;
The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Quartz crystal resonators; Monolithic filters; Oscillators
 
 
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