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Hermetic Packages for Low and Medium Power Integrated Circuits

Ceramic Leaded Chip Carriers or Flat Packs 402.16-32; 402.16-33; 402.16-41

Number of Pins: 16

Description:

Flat package (FP) is a rectangular package with leads parallel to base plane attached on two opposing sides of the package periphery;
Leadframes are brazed on the top of a multilayer ceramic substrate;
The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Printed-circuit-board surface-mount-component package;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Increased Reliability Integrated Circuits

Ceramic Leaded Chip Carriers or Flat Packs 402.16-18.06

Number of Pins: 16

Description:

Flat package (FP) is a rectangular package with leads parallel to base plane attached on two opposing sides of the package periphery;
Leadframes are brazed on the bottom of a multilayer ceramic substrate;
The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Printed-circuit-board surface-mount-component package;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Increased Reliability Integrated Circuits

Side Braze package or Ceramic Dual-in-Line Package (CerDIP) 2101.8-7.01

Description:

The Side Braze package, commonly known as a "DIP", consists of two rows of leads brazed onto the sides of the ceramic base;
The quantity of pins - 8 ;
Pin pitch - 2,5mm;
Through-hole package (Plug-Ins);
The bottom and the walls of these packages constructed of high temperature coffered ceramic;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding;
The DIP is widely used due to its reliability, high performance, and ease of use.
They can be mounted on a PC board with socket, manual or automated equipment.

Typical Applications:

Increased Reliability Integrated Circuits
 
 
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