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Hermetic Packages for Integrated Circuits

Transistor Outline Style Package TO-3 or “metal can”or Metal Header Package

Unit designation Corps: 311.8-2, 311.10-1, 3206.8-1

Number of Pins: 8 insulated

Description:

Transistor Outline Package;
Through-hole package (Plug-Ins);
TO-3 packages are heatsinkable;
TO-3 packages have two tabs with holes for mounting to a heatsink;
The pin count – 8;10;
8 insulated (the pin pass through the metal plate and a glass seal), accordingly;
The form of the pin short part - a cylinder or “nail head”;
The basic method of the hermetic sealing - Resistance welding

Typical Applications:

Power Transistors, Power Diods Monochip Power Circuits of Amplifiers, Voltage Regulator, Invertors, Rectifiers Opto-electronics Devices

14-lead Glass-To-Metal Flatpack Package

Number of Pins: 14 insulated

Description:

Flat package (FP).
A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery.
The Glass/ceramic system sidewall package;
Surface mount package;
The terminal count: 14 insulated;
Die bonding - eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low Power Circuits

14-lead Glass-To-Metal Flatpack Package

Number of Pins: 14 insulated

Description:

Flat package (FP).
A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery.
The Glass/ceramic system sidewall package;
Surface mount package;
The terminal count: 14 insulated;
Die bonding - adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low Power Circuits

Glass-To-Metal Flatpack Package

Number of Pins: 14 (12 feedthrus, two from them are connected to die attach areas)

Description:

Flat package (FP). A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery;
The Glass/ceramic system sidewall package; Surface mount package;
The terminal count: 14 (12 feedthrus, two from them are connected to die attach areas);
Die bonding - eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low Power Circuits

14-lead Glass-to-Metal Flatpack Package

Number of Pins: 14 insulated

Description:

Flat package (FP).
A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery;
The Bottom and the Walls of package are made from metal;
Surface mount package;
The terminal count - 14 insulated;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low and Medium Power Itegrated Circuits

Transistor Outline Style Package TO-5

Number of Pins: 2,4,6,8,12 - insulated

Description:

Transistor Outline Package (also can be found as Metal TO Package or Metal can (Can) or Metal Header Package);
Through-hole package (Plug-Ins);
For 2,4,6,8,12-lead TO-5 packages - all pins are insulated, and for 5-lead TO-5 package - 4 pins are insulated and 1 pin is grounded;
The form of the short pin part - a cylinder or “nail head”;
The basic method of the hermetic sealing - Resistance welding

Typical Applications:

Low Power Circuits of Amplifiers, D/A and A/D converters, Comparators;Diodes;Transistors;Opto-electronics Devices

6-lead Glass-to-Metal Flatpack Package

Number of Pins: 6 insulated

Description:

Flat package (FP).
A rectangular package with leads parallel to base plane passed through the two opposing sides of the package periphery;
The Bottom and the Walls of package are made from metal;
Surface mount package;
The terminal count - 6 insulated;
Die bonding – eutectic or adhesive;
The basic method of hermetic sealing - parallel seam welding

Typical Applications:

Low and Medium Power Itegrated Circuits
 
 
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